Intermediate Assembly Engineer

Location: Fort Meade, MD
Date Posted: 03-01-2018
Responsibilities will include the following:
• Developing unique solutions to challenging packaging and assembly problems
• Ensuring processes and tools are configured to comply with customer product specifications in a microelectronics assembly operation
• Qualifying new processes and training assembly operators, technicians, and customer engineers
• Developing processes and tools to support prototype quantities and full scale production
• Researching and adapting new packaging techniques to solve tough assembly problems
Qualifications:
• BS or Master’s Degree in an appropriate technical discipline, e.g., Electrical, Chemical, Mechanical, Materials or Microelectronic Engineering, Chemistry or Physics.  Minimum of two years’ experience in the field or a degree in Microelectronic Engineering or a Masters or PhD degree in one of the areas cited above.
• Ability to research and adapt new packaging techniques to solve tough assembly problems
• Active TS/SCI with polygraph required
Preferred Additional Skills:
• Master’s Degree in an appropriate technical discipline, e.g., Electrical, Chemical, Mechanical, Materials or Microelectronic Engineering, Chemistry or Physics
• 6 + year of experience with Microelectronic packaging processes and/or Printed Circuit Board (PCB) / Surface Mount Technology (SMT) assembly processes
• 6 + year of experience in designing and qualifying assembly procedures
• 6 + year of experience in setting up process equipment and qualifying production processes
• 6 + year of experience with microelectronic assembly techniques including mechanical and chemical processes
 
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